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Dielectric and Thermal Behaviour Analysis of Epoxy Composites Filled with Date Seed Particles using Finite Element Method | ||
Mechanics of Advanced Composite Structures | ||
مقالات آماده انتشار، پذیرفته شده، انتشار آنلاین از تاریخ 10 شهریور 1404 اصل مقاله (368.25 K) | ||
نوع مقاله: Research Article | ||
شناسه دیجیتال (DOI): 10.22075/macs.2025.36745.1797 | ||
نویسندگان | ||
Lokanatha Dhall Samanta1؛ Priyabrat Pradhan2؛ Hemalata Jena3؛ Abhilash Purohit* 4؛ Bibhuti Bhusan Sahoo5 | ||
1Department of Electrical Engineering, Synergy Institute of Engineering and Technology, Dhenkanal, Odisha, India | ||
2Department of Mechanical Engineering, Synergy Institute of Engineering and Technology, Dhenkanal, Odisha, India | ||
3School of Mechanical Engineering, KIIT Deemed to be University, Bhubaneswar, Odisha, India | ||
4Department of Mechanical Engineering, Galgotias University, Greater Noida, Uttar Pradesh, India | ||
5School of Mechanical Engineering, Vellore Institute of Technology, Vellore, Tamil Nadu, India | ||
تاریخ دریافت: 11 بهمن 1403، تاریخ بازنگری: 13 مرداد 1404، تاریخ پذیرش: 10 شهریور 1404 | ||
چکیده | ||
This study reports the thermal and dielectric behaviours of epoxy composites filled with date seed particles. DSP-epoxy composites are fabricated by adding date seed powder into epoxy resin at varying weight (0-25 %) and volume (0-17.95 %) fractions using a hand layup technique. The thermal conductivity of the composites is measured by UnithermTM2022 and HIOKI-3532-50 Hi Tester ElsierAnalyzer determines the dielectric constant. The finite element method (FEM) using Digimat FE software is used to simulate the thermal conductivity of the DSP-epoxy composites. The result showed that the thermal conductivity of the epoxy reduced by 27 % from 0.362 W/ m-K to 0.261 W/ m-K with the addition of 17.95 vol. % of DSP. The FEM-predicted values are found to be closest to the measured values, with an error range of 6-10%. The dielectric constant of the composites increased with the addition of DSP content across all frequency ranges due to interfacial and dipolar polarization. However, the dielectric constant decreased at high frequencies due to a lag in dipole orientation. | ||
کلیدواژهها | ||
Epoxy composites؛ Date seed particle؛ Thermal characterization؛ Conductivity؛ Dielectric constant | ||
آمار تعداد مشاهده مقاله: 4 تعداد دریافت فایل اصل مقاله: 5 |