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Samanta, Lokanatha, Pradhan, Priyabrat, Jena, Hemalata, Purohit, Abhilash, Sahoo, Bibhuti. (1404). Dielectric and Thermal Behaviour Analysis of Epoxy Composites Filled with Date Seed Particles using Finite Element Method. نشریه هنرهای کاربردی, (), -. doi: 10.22075/macs.2025.36745.1797
Lokanatha Dhall Samanta; Priyabrat Pradhan; Hemalata Jena; Abhilash Purohit; Bibhuti Bhusan Sahoo. "Dielectric and Thermal Behaviour Analysis of Epoxy Composites Filled with Date Seed Particles using Finite Element Method". نشریه هنرهای کاربردی, , , 1404, -. doi: 10.22075/macs.2025.36745.1797
Samanta, Lokanatha, Pradhan, Priyabrat, Jena, Hemalata, Purohit, Abhilash, Sahoo, Bibhuti. (1404). 'Dielectric and Thermal Behaviour Analysis of Epoxy Composites Filled with Date Seed Particles using Finite Element Method', نشریه هنرهای کاربردی, (), pp. -. doi: 10.22075/macs.2025.36745.1797
Samanta, Lokanatha, Pradhan, Priyabrat, Jena, Hemalata, Purohit, Abhilash, Sahoo, Bibhuti. Dielectric and Thermal Behaviour Analysis of Epoxy Composites Filled with Date Seed Particles using Finite Element Method. نشریه هنرهای کاربردی, 1404; (): -. doi: 10.22075/macs.2025.36745.1797

Dielectric and Thermal Behaviour Analysis of Epoxy Composites Filled with Date Seed Particles using Finite Element Method

Mechanics of Advanced Composite Structures
مقالات آماده انتشار، پذیرفته شده، انتشار آنلاین از تاریخ 10 شهریور 1404    اصل مقاله (368.25 K)
نوع مقاله: Research Article
شناسه دیجیتال (DOI): 10.22075/macs.2025.36745.1797
نویسندگان
Lokanatha Dhall Samanta1؛ Priyabrat Pradhan2؛ Hemalata Jena3؛ Abhilash Purohit* 4؛ Bibhuti Bhusan Sahoo5
1Department of Electrical Engineering, Synergy Institute of Engineering and Technology, Dhenkanal, Odisha, India
2Department of Mechanical Engineering, Synergy Institute of Engineering and Technology, Dhenkanal, Odisha, India
3School of Mechanical Engineering, KIIT Deemed to be University, Bhubaneswar, Odisha, India
4Department of Mechanical Engineering, Galgotias University, Greater Noida, Uttar Pradesh, India
5School of Mechanical Engineering, Vellore Institute of Technology, Vellore, Tamil Nadu, India
تاریخ دریافت: 11 بهمن 1403،  تاریخ بازنگری: 13 مرداد 1404،  تاریخ پذیرش: 10 شهریور 1404 
چکیده
This study reports the thermal and dielectric behaviours of epoxy composites filled with date seed particles. DSP-epoxy composites are fabricated by adding date seed powder into epoxy resin at varying weight (0-25 %) and volume (0-17.95 %) fractions using a hand layup technique. The thermal conductivity of the composites is measured by UnithermTM2022 and HIOKI-3532-50 Hi Tester ElsierAnalyzer determines the dielectric constant. The finite element method (FEM) using Digimat FE software is used to simulate the thermal conductivity of the DSP-epoxy composites. The result showed that the thermal conductivity of the epoxy reduced by 27 % from 0.362 W/ m-K to 0.261 W/ m-K with the addition of 17.95 vol. % of DSP. The FEM-predicted values are found to be closest to the measured values, with an error range of 6-10%. The dielectric constant of the composites increased with the addition of DSP content across all frequency ranges due to interfacial and dipolar polarization. However, the dielectric constant decreased at high frequencies due to a lag in dipole orientation.
کلیدواژه‌ها
Epoxy composites؛ Date seed particle؛ Thermal characterization؛ Conductivity؛ Dielectric constant
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