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singh, vinay, SUNDER, SHYAM, bhaskar, Jitendra. (1405). Fabrication and Characterization of Polymer Composites Reinforced with Recycled Printed Circuit Board (PCB) Fillers. هنرهای کاربردی, (), -. doi: 10.22075/macs.2026.37888.1860
vinay pratap singh; SHYAM SUNDER; Jitendra bhaskar. "Fabrication and Characterization of Polymer Composites Reinforced with Recycled Printed Circuit Board (PCB) Fillers". هنرهای کاربردی, , , 1405, -. doi: 10.22075/macs.2026.37888.1860
singh, vinay, SUNDER, SHYAM, bhaskar, Jitendra. (1405). 'Fabrication and Characterization of Polymer Composites Reinforced with Recycled Printed Circuit Board (PCB) Fillers', هنرهای کاربردی, (), pp. -. doi: 10.22075/macs.2026.37888.1860
singh, vinay, SUNDER, SHYAM, bhaskar, Jitendra. Fabrication and Characterization of Polymer Composites Reinforced with Recycled Printed Circuit Board (PCB) Fillers. هنرهای کاربردی, 1405; (): -. doi: 10.22075/macs.2026.37888.1860

Fabrication and Characterization of Polymer Composites Reinforced with Recycled Printed Circuit Board (PCB) Fillers

Mechanics of Advanced Composite Structures
مقالات آماده انتشار، پذیرفته شده، انتشار آنلاین از تاریخ 28 خرداد 1405    اصل مقاله (670.39 K)
نوع مقاله: Research Article
شناسه دیجیتال (DOI): 10.22075/macs.2026.37888.1860
نویسندگان
vinay pratap singh* 1؛ SHYAM SUNDER2؛ Jitendra bhaskar3
1Professor, ME Deptt, HBTU, Kanpur, UP
2MECHANICAL ENGINEERINFG DEPARTMENT
3mechanical engineering department
تاریخ دریافت: 06 خرداد 1404،  تاریخ بازنگری: 11 اردیبهشت 1405،  تاریخ پذیرش: 28 خرداد 1405 
چکیده
The rapid growth of electronic waste has encouraged the reuse of non-metallic printed circuit board (PCB) residues as fillers in polymer composites. This work investigates high-density polyethylene (HDPE) composites reinforced with 10–30 wt% PCB powder, focusing on their mechanical and structural response. Experimental results show a substantial enhancement in stiffness, with tensile and flexural moduli increasing by up to 176% and 85%, respectively, as PCB content increases. In contrast, tensile strength and impact toughness decline, primarily due to weak filler–matrix bonding and the formation of micro-voids. SEM observations reveal irregular PCB particle morphology and interfacial defects that govern the observed mechanical degradation. FTIR and XRD analyses indicate no new phase formation but suggest constrained polymer chain mobility in the presence of rigid PCB fillers. Micromechanical predictions based on rule-of-mixtures bounds agree well with the experimental modulus values. Overall, the study demonstrates a stiffness–toughness trade-off and identifies HDPE/PCB composites as suitable for non-load-critical applications where high bending rigidity is required, offering a sustainable pathways for PCB waste utilization.
کلیدواژه‌ها
E- waste؛ Environmental؛ Matrix؛ Mechanical characterization؛ Recycling
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